Fig. 23: Internal construction
The internal power supply voltage for the module's circuitry is carried out via the I/O bus
(provided by a communication interface module or a CPU). Thus, the current consumption from
24 V DC power supply at the terminals L+/UP and M/ZP of the CPU/communication interface
module increases by 2 mA per DX531. The external power supply connection is carried out via
the UP (+24 V DC) and the ZP (0 V DC) terminals.
WARNING!
Removal/Insertion under power
Removal or insertion under power is only permissible under conditions
described in Hot Swap chapter
Chapter 1.6 “I/O modules” on page 142
The devices are not designed for removal or insertion under power when Hot
Swap conditions do not apply. Because of unforeseeable consequences, it is
not allowed to plug or unplug devices with the power being ON.
Make sure that all voltage sources (supply and process voltage) are switched
off before you
–
connect or disconnect any signal or terminal block
–
remove, mount or replace a module.
Disconnecting any powered devices while energized in a hazardous location
could result in an electric arc, which could create a flammable ignition resulting
in fire or explosion.
Make sure that power is removed and that the area has been thoroughly
checked to ensure that flammable materials are not present prior to proceeding.
The devices must not be opened when in operation. The same applies to the
network interfaces.
Device specifications
I/O modules > Digital I/O modules
2022/01/31
3ADR010278, 3, en_US
342
