32
Chapter 1
NOTE:
Above table lists some system memory configurations. You may combine DIMMs with various
capacities to form other combinations. On above table, the configuration of slot 1 and slot 2 could be
reversed.
LAN Interface
Item
Specification
Chipset
Broadcom 5787
Supports LAN protocol
10/100/1000 Ethernet
Giga LAN
LAN connector type
RJ45
LAN connector location
Left side
Features
Integrated 10/100/1000 BASE-T transceiver
Wake on LAN support compliant with ACPI 2.0
PCI v2.2
Modem Interface
Item
Specification
Data modem data baud rate (bps)
56K
Supports modem protocol
V.92
Modem connector type
RJ11
Modem connector location
Right side
Bluetooth Interface
Item
Specification
Chipset
Foxconn Bluetooth
®
2.0+EDR
Data throughput
723 bps (full speed data rate)
Protocol
Bluetooth 1.1 (Upgradeable to Bluetooth 1.2 when SIG
specification is ratified).
Interface
USB 1.1
Connector type
USB
Wireless Module 802.11a/b/g/n
Item
Specification
Chipset
Intel 4965AGN/3945ABG/3945BG
Data throughput
11~54 Mbps
Protocol
802.11a+b+g+Draft-n/802.11a+b+g/802.11b+g
Interface
PCI
Hard Disk Drive Interface
Item
Vendor &
Model Name
HGST HTS541680J9SA00
Seagate ST980811AS
Toshiba MK8037GSX
WD WD800BEVS-
22RST0
HGST HTS541612J9SA00
Seagate ST9120822AS
Toshiba MK1237GSX
WD WD1200BEVS-
22RST0
HGST HTS541616J9SA00
Seagate ST9160821AS
Toshiba MK1637GSX
WD WD1600BEVS-
22RST0
Toshiba MK2035GSS
Capacity (MB)
80000
120000
160000
200000
Bytes per
sector
512
512
512
512
Summary of Contents for Aspire 5310
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Page 10: ...4 Chapter 1 System Block Diagram ...
Page 29: ...Chapter 1 23 ...
Page 44: ...38 Chapter 1 ...
Page 58: ...91 Chapter 2 ...
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