SERIES AP470 ACROPACK
USER
’S MANUAL
Acromag, Inc. Tel: 248-295-0310
- 10 -
http://www.acromag.com
- 10 -
www.acromag.com
2.2 Installation Considerations
IMPORTANT: Adequate air
circulation must be provided to
prevent a temperature rise
above the maximum operating
temperature.
Refer to the specifications section for loading and power requirements. Be
sure that the system power supplies are able to accommodate the power
requirements of the system boards, plus the installed Acromag board,
within the voltage tolerances specified.
In an air cooled assembly, adequate air circulation must be provided to
prevent a temperature rise above the maximum operating temperature and
to prolong the life of the electronics. If the installation is in an industrial
environment and the board is exposed to environmental air, careful
consideration should be given to air-filtering.
In a conduction cooled assembly, adequate thermal conduction must be
provided to prevent a temperature rise above the maximum operating
temperature.
2.3 Non-Isolation Considerations
The board is non-isolated, since there is electrical continuity between the
PCIe bus and AcroPack module grounds. As such, the field I/O connections
are not isolated from the system. Care should be taken in designing
installations without isolation to avoid noise pickup and ground loops
caused by multiple ground connections.
2.4 Field I/O Connector
A field I/O interface connector provides a mating interface between the AP
modules and the carrier board. The 100 pin ST5-50-1.50-L-D-P-TR Samtec
connector is used on the AcroPack card as board to board interconnect.
This connector will mate with the 100 pin SS5-50-3.00-L-D-K-TR Samtec
connector on the carrier. The stack height is 4.5mm.
Pin assignments are unique to each AP model. Table 2.1 lists signal pin
assignments for the module field I/O connector. Pins are left unconnected in
order to meet the minimum creepage distance required for 60 Volt
isolation.
For the most accurate pinout information, see the manual of the specific
carrier board model being used.