Chapter 1: Product Introduction
I/O Interface - Rear
▪
1x USB2.0
▪
1x HDMI
▪
1x RTC Battery
▪
2x DB9 for COM3 & COM4
▪
1x Mic-in & 1 x Line-out
▪
2x Antenna Holes for optional Wi-Fi/3.5G antenna
▪
1x Optional I/F for optional mini-PCIe Wi-Fi/3.5G/Hilscher Automation
module output
I/O Interface - Internal
▪4x GPI and 4 GPO (5V, TTL Type)
Storage Device
▪
1x CFast (SATA2.0)
▪
1x 2.5” SSD (SATA2.0)
Expansion Slot
▪1x Mini
-PCIe socket for optional Wi-Fi/3.5G/Hilscher automation modules
Power Requirements
▪Power input: +9VDC to 30VDC, 6.6
A to 2A
Support OS
▪
Windows 8
▪
Windows Embedded Standard 8
▪
Windows 7
▪
Windows Embedded Standard 7
▪
Windows Embedded Compact 7
▪
Linux Kernel version 3.8.0
Dimensions
▪185mm (W) x 131mm (D) x 54mm (H) without wall
-mount bracket
Construction
▪Aluminum and M
etal Chassis with fanless design)
Environment
•
Operating Temperature:
Ambient with air flow: -20°C to 70°C with industrial grade device
(According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14)
•
Storage Temperature: -30°C to 85°C
•
Relative Humidity: 10% to 95% (non-Condensing)
•
Shock Protection:
HDD: 20G, half sine, 11ms, IEC60068-27
CFast: 50G, half sine, 11ms, IEC60068-27
•
Vibration Protection w/HDD Condition:
Random: 0.5Grms @ 5~500 Hz, IEC60068-2-64
Sinusoidal: 0.5Grms @ 5~500 Hz, IEC60068-2-6
•
Vibration Protection w/CFast & SSD Condition:
Random: 2Grms @ 5~500 Hz, IEC60068-2-64
Sinusoidal: 2Grms @ 5~500 Hz, IEC60068-2-6
Certifications
▪
CE
▪
FCC Class A
▪
UL/cUL
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