4
Specifications
z
M.2
:
•
Q370 SKU: 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/BT module, 1x M.2 B key supporting 2242 or
2280 for SATA storage module, 1x M.2 M key supporting 2242 or 2280 for SATA/PCIe x4 storage module
•
H310 SKU: 1x M.2 E key supporting 1630 or 2230 for Wi-Fi /BT module, 1x M.2 B key supporting 2242 or
2280 for SATA storage module
2.3 Video
z
Graphics Engine
:
•
Integrated Intel® HD Graphics series (based on CPU, Q370 SKU supports three independent display and
H310 SKU supports two independent display)
•
ADLINK MXM module (optional)
z
Interfaces
:
•
From Intel® HD Graphics:
2x DP connector, resolution up to 4096 x 2304 @ 60 Hz, and DP++ support
1x HDMI connector (vertical type on PCB), resolution up to 4096 x 2160 @ 24 Hz
1x LVDS (optional, default is WO/LVDS), dual channel 24-bit or 18-bit up to 1920 x 1200 Hz
•
From MXM:
4x DP connectors, signal from MXM module, resolution based on MXM module, DP++ support
2.4 Audio
z
Audio Codec
: Realtek® ALC262-VC2-GR or ALC888S-VD2-GR
•
Interfaces:
Default: 1x 10-pin wafer (box header) for Mic-in/Line out/Line in, connector via additional audio module
Optional 1: Mic in / 6W speake6W speaker_out_R. (onboard 10-pin wafer, connector via
additional audio module)
Optional 2: Line in / 6W speake6W speaker_out_R. (onboard 10-pin wafer, connector via
additional audio module)
2.5 Power
Supply
z
DC input
: DC 12V input (Molex DC-in jack)
z
AC input
:
•
Optional: 240W (12V @20A) AC/DC adapter
•
Optional: 500W (12V @41.7A) AC/DC power supply
2.6 Temperatures
z
Operating Temperature
:
•
0°C to 60°C (w/o MXM)
•
0°C to 55°C (w/MXM, excluding EGX-MXM-RTX5000)
•
0°C to 45°C (EGX-MXM-RTX5000)
z
Storage Temperature
: -40°C to 85°C
2.7 Humidity
z
5% to 95%, non-condensing
Summary of Contents for AMSTX-CF Series
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