T
able
10-2.
List
of
Abbreviations
A
:
amp eres
N/C
:
normally
closed
A.F.C.
:
automatic
frequency
con
trol
NE
:
neon
AMPL
:
amplier
NI
PL
:
nick
el
plate
B.F.O
:
b eat
frequency
oscillator
N/O
:
normally
op en
BE
CU
:
b eryllium
copp
er
NPO
:
negativ
e
p ositiv
e
zero
(zero
temp
erature
co ecien
t)
BH
:
binder
head
NPN
:
negativ
e-p ositiv
e-negative
BP
:
bandpass
NRFR
:
not
recommended
for
eld
replacement
BRS
:
brass
NSR
:
not
separately
replaceable
BW
O
:
bac
kw
ard
w
a
v
e
oscillator
OBD
:
order
b
y
description
CCW
:
counter-clo
ckwise
OH
:
o
v
al
head
CER
:
ceramic
O
X
:
o
xide
CMO
:
cabinet
moun
t
only
P
:
p eak
COEF
:
co ecien t
PC
:
printed
circuit
COM
:
common
p
:
pico
COMP
:
comp
osition
PH
BRZ
:
phosphor
bronze
COMPL
:
complete
PHL
:
Philips
CONN
:
connector
PIV
:
p eak
inv
erse
v
oltage
CP
:
cadmium
plate
PNP
:
p ositiv
e-negative-p ositiv
e
CR
T
:
catho de-ra
y
tub
e
P/O
:
part
of
CW
:
clo
ckwise
POL
Y
:
p olyst
yrene
DE
PC
:
dep
osited
carb
on
POR
C
:
p orcelain
DR
:
drive
POS
:
p osition(s)
ELECT
:
electrolytic
POT
:
p oten
tiometer
ENCAP
:
encapsulated
PP
:
p eak
to
p eak
EXT
:
external
PT
:
p oin
t
F
:
farads
PWV
:
p eak
w
orking
v
oltage
f
:
femto
RECT
:
rectier
FH
:
at
head
RF
:
radio
frequency
FIL
H
:
llister
head
RH
:
round
head
or
righ
t
hand
FXD
:
xed
RMO
:
rac
k
moun
t
only
G
:
giga
RMS
:
ro ot-mean
square
GE
:
germanium
R
WV
:
reverse
w
orking
v
oltage
GL
:
glass
S-B
:
slo
w-blo
w
GRD
:
ground(ed)
SCR
:
screw
H
:
henries
SE
:
selenium
HEX
:
hexagonal
SECT
:
section(s)
HG
:
mercury
SEMICON
:
semiconductor
HR
:
hour(s)
SI
:
silicon
Hz
:
hertz
SIL
:
silv
er
IF
:
intermediate
freq.
SL
:
slide
IMPG
:
impregnated
SPG
:
spring
INCD
:
incandescent
SPL
:
sp ecial
INCL
:
include(s)
SST
:
stainless
steel
INS
:
insulation(ed)
SR
:
split
ring
INT
:
internal
STL
:
steel
k
:
kilo
T
A
:
tan
talum
LH
:
left
hand
TD
:
time
delay
LIN
:
linear
tap er
TGL
:
toggle
LK
W
ASH
:
lo ck
w
asher
THD
:
thread
LOG
:
logarithmic
tap er
TI
:
titanium
LPF
:
lo
w
pass
lter
TOL
:
tolerance
m
:
milli
TRIM
:
trimmer
M
:
meg
TWT
:
tra
v
eling
w
a
v
e
tub
e
MET
FLM
:
metal
lm
:
micro
MET
O
X
:
metallic
o
xide
V
AR
:
v
ariable
MFR
:
man
ufacturer
VDCW
:
dc
w
orking
v
olts
MINA
T
:
miniature
W/
:
with
MOM
:
momentary
W
:
w
atts
MTG
:
moun
ting
WIV
:
w
orking
inv
erse
v
oltage
MY
:
\m
ylar"
WW
:
wirew
ound
n
:
nano
W/O
:
without
Replaceable
P
arts
10-3
Summary of Contents for 4395A
Page 10: ......
Page 26: ......
Page 34: ......
Page 77: ...Figure 2 17 B R Magnitude Ratio Phase Dynamic Accuracy Test Setup 2 Performance Tests 2 43 ...
Page 167: ...Figure 5 1 Adjustment Hardware Setup Adjustments 5 5 ...
Page 186: ...Figure 5 13 Receiver Gain Adjustment Location 5 24 Adjustments ...
Page 190: ...Figure 5 16 Receiver Flatness Adjustment Setup 1 MHz 5 28 Adjustments ...
Page 194: ...Figure 5 20 DC Bias Adjustment Setup 2 5 32 Adjustments ...
Page 196: ...Figure 6 1 Troubleshooting Organization 6 2 Troubleshooting ...
Page 206: ...Figure 7 1 Power Supply Lines Simplified Block Diagram 7 2 Power Supply Troubleshooting ...
Page 212: ...Figure 7 5 A1 CPU Connector Locations 7 8 Power Supply Troubleshooting ...
Page 220: ...Figure 8 1 Digital Control Group Simplified Block Diagram 8 2 Digital Control Troubleshooting ...
Page 240: ...Figure 10 1 Top View Major Assemblies 10 4 Replaceable Parts ...
Page 292: ...Table A 2 Manual Changes by Firmware Version Version Make Manual Changes A 2 Manual Changes ...
Page 308: ......
Page 311: ...Figure B 1 Power Cable Supplied Power Requirement B 3 ...
Page 312: ......
Page 342: ......