Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory products
in FBGA packages.
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
T h e p a c k a g e a n d / o r d a t a i n t e g r i t y m a y b e
compromised if the package body is exposed to
temperatures above 150
°
C for prolonged periods of
time.
PIN CONFIGURATION
A0–A18
=
19 addresses
DQ0–DQ14 =
15 data inputs/outputs
DQ15/A-1
=
DQ15 (data input/output, word mode),
A-1 (LSB address input, byte mode)
BYTE#
=
Selects 8-bit or 16-bit mode
CE#
=
Chip enable
OE#
= Output
enable
WE#
=
Write enable
RESET#
=
Hardware reset pin, active low
RY/BY#
= Ready/Busy#
output
V
CC
=
3.0 volt-only single power supply
(see Product Selector Guide for speed
options and voltage supply tolerances)
V
SS
=
Device ground
NC
=
Pin not connected internally
LOGIC SYMBOL
19
16 or 8
DQ0–DQ15
(A-1)
A0–A18
CE#
OE#
WE#
RESET#
BYTE#
RY/BY#
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Page 103: ...Input configuration Power amplifier ...
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Page 111: ...Exploded View Diagram Exploded View Diagram ...