Appendix B: System Specifications
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Appendix B
System Specifications
Processors
Dual 3rd Gen Intel Xeon Scalable processors in a P+ (LGA4189) socket with up to 40 cores and the thermal design power
(TDP) of up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors.
Chipset
Intel PCH C621A (LBG-R)
BIOS
AMI 64Mb SPI Flash ROM
Memory
Thirty-two slots DDR4 RDIMM/LRDIMM or Intel Optane PMem 200 Series, Up to 3200 MHz
(8TB for DDR4, or 8TB of PMem and 4TB DDR4)
Note: PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.
Storage Drives
Twelve hot-swap 2.5" bays for SATA; SAS or NVMe can be supported with additional equipment
Two SuperDOM (Disk on Module) headers
PCI Expansion Slots
Two PCIe x16 full height, 10.5" length
One PCIe x16 low profile
One internal PCIe x16 low profile (Ultra riser)
Input/Output
Network: Zero, two, or four LAN ports, varies by model
BMC: Dedicated LAN port
USB: Three USB 3.0 ports
—2 rear, 1 front
Video: One VGA port
COM port: One serial header
Motherboard
X12DPU-6; 16.8" (W) x 17." (L) (427 mm x 432 mm)
Chassis
119UH3TS-R1K22P-T; 1U Rackmount,
(WxHxD)
17.2” x 1.7” x 29.1” (437x43x739 mm)
System Cooling
Eight 4-cm counter-rotating fans, two CPU heatsinks, two air shrouds to direct air flow
Power Supply
Model:
(default)
PWS-1K22A-1R, 1200W redundant modules, 80Plus Titanium level;
Optional: 1600W/2000W
AC Input
100-127 Vac, 50-60 Hz
200-240 Vac, 50-60 Hz
+12V
800W, 66.7A (100 Vac
–127 Vac)
1200W, 100A (200 Vac
–240 Vac)
+12 V standby: 2.1A