AD9776A/AD9778A/AD9779A
Rev. B | Page 9 of 56
ABSOLUTE MAXIMUM RATINGS
Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameter With
Respect
To
Rating
AVDD33, DVDD33
AGND, DGND,
CGND
−0.3 V to +3.6 V
DVDD18, CVDD18
AGND, DGND,
CGND
−0.3 V to +2.1 V
AGND
DGND, CGND
−0.3 V to +0.3 V
DGND
AGND, CGND
−0.3 V to +0.3 V
CGND
AGND, DGND
−0.3 V to +0.3 V
I120, VREF, IPTAT
AGND
−0.3 V to
0.3 V
OUT1_P, OUT1_N,
OUT2_P, OUT2_N,
AUX1_P, AUX1_N,
AUX2_P, AUX2_N
AGND
−1.0 V to
0.3 V
P1D[15:0], P2D[15:0]
DGND
−0.3 V to
0.3 V
DATACLK, TXENABLE
DGND
−0.3 V to
0.3 V
, REFCLK−
CGND
−0.3 V to
0.3 V
RESET, IRQ, PLL_LOCK,
, SYNC_O−,
, SYNC_I−,
CSB, SCLK, SDIO, SDO
DGND
−0.3 V to
0.3 V
Junction Temperature
+125°C
Storage Temperature
Range
−65°C to +150°C
THERMAL RESISTANCE
For optimal thermal performance, the exposed paddle (EPAD)
should be soldered to the ground plane for the 100-lead,
thermally enhanced TQFP package.
Typical θ
JA
and θ
JC
are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
.
Table 6. Thermal Resistance
Package Type
θ
JA
θ
JB
θ
JC
Unit
100-Lead
TQFP
EPAD Soldered
19.1
12.4
7.1
°C/W
EPAD Not Soldered
27.4
°C/W
ESD CAUTION