ADV7181B
Rev. B | Page 99 of 100
OUTLINE DIMENSIONS
*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
PIN 1
INDICATOR
TOP
VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.45
0.40
0.35
0.30
0.25
0.18
7.50
REF
0.60 MAX
0.60 MAX
*7.25
7.10 SQ
6.95
PIN 1
INDICATOR
0.25 MIN
0.50 BSC
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
SEATING
PLANE
EXPOSED PAD
(BOTTOM VIEW)
THE EXPOSED METAL PADDLE ON THE
BOTTOM OF THE LFCSP PACKAGE MUST
BE SOLDERED TO PCB GROUND FOR PROPER
HEAT DISSIPATION AND ALSO FOR NOISE
AND MECHANICAL STRENGTH BENEFITS.
Figure 46. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 × 9 mm Body, Very Thin Quad (CP-64-3)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
TOP VIEW
(PINS DOWN)
1
16
17
33
32
48
49
64
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
10.00
BSC SQ
12.00
BSC SQ
PIN 1
1.60
MAX
0.75
0.60
0.45
VIEW A
0.20
0.09
1.45
1.40
1.35
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90° CCW
SEATING
PLANE
0.15
0.05
7°
3.5°
0°
Figure 47. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimeters
