8
CAUTION:
Improper usage can cause serious injury to personnel and/or
damage to equipment and work area. For your own safety, please observe
the following precautions.
SAFETY PRECAUTIONS
●
Check each component after opening the package to make sure
everything is in good condition. If there are any suspected
damage, do not use the item and report the issue to your vendor.
●
Turn OFF the main power switch and unplug the device from
power source when moving the device.
●
Do not strike or subject the main unit (and all its components) to
physical shock. Use carefully to avoid damage to any part.
●
Handle with care.
Never drop or sharply jolt the unit.
Contains delicate parts that may break if the unit is dropped.
●
Make sure the equipment is always grounded. Always connect
power to a grounded receptacle.
●
Temperature may reach as high as 480°C when switched ON.
Do not use the device near flammable gases, paper and other flammable
materials.
Do not touch heated parts, which can cause severe burns.
Do not touch metallic parts near the tip.
●
Disconnect the plug from the power source if the unit will not be
used for a long period.
Turn off power during breaks, if possible.
●
Use only genuine replacement parts.
Turn off power and let the unit cool down before replacing any part.
●
The unit may produce a small amount of smoke and unusual odor
during initial usage. This is normal and should not yield any
negative result when reworking.
●
Soldering process produces smoke — use on well ventilated places.
●
Do not alter the unit, specifically the internal circuitry, in any
manner.
17
OPERATING GUIDELINES
Soldering:
1. Follow procedures in, “
A. INITIAL PROCEDURES
”.
2. Prepare the unit to be worked upon on a stable elevated
surface. A working platform with locking mechanisms to
secure the PCB is highly recommended. Use a preheating
station if appropriate.
3. Apply solder paste to the PCB .
4. Pick up the hot air gun.
5. Set the temperature control knob to about 250°C.
6.
Turn the airflow control knob to a minimum airflow.
7.
Wait for the heater LED to start blinking. This signifies that the
hot air temperature has attained its temperature setting.
8.
Place the hot air gun vertically on top of the target device.
This will allow hot air to directly heat up the target device and
the solder paste. Use appropriate nozzle for better soldering.
9.
Solder paste would melt and solder target device and the PCB
together.
10. Let PCB cool down.
Note
:
Air flow and temperature may vary depending on size of components.
ATTENTION
●
Temperature setting presented in these guides are provided
as reference only. Please refer to device manufactures data
for the tolerances of the items to be soldered.
●
Actual temperature settings for soldering and reworking are
dependent on the size of the material to be soldered and
solder paste reflow temperatures.
●
Very high reworking temperatures can damage sensitive SMT
materials.
