EC
D
e
c
la
ra
ti
o
n
o
f C
o
n
fo
rmit
y
W
e
,
the
unde
rs
ign
e
d,
M
a
nuf
a
c
tur
e
r:
ASU
ST
e
K
C
O
M
PU
T
ER
I
N
C
.
A
d
d
ress:
4
F
, N
o
.
1
5
0
,
L
I-
T
E
R
d
., P
E
IT
O
U
, T
A
IP
E
I 1
1
2
, T
A
IW
A
N
A
ut
hor
iz
e
d
re
pr
e
s
e
nt
a
ti
v
e
i
n
E
ur
ope
:
ASU
S
C
O
M
PU
T
ER
G
m
b
H
A
d
d
re
s
s
, C
it
y
:
H
A
R
K
O
R
T
S
T
R
.
21-
23,
4088
0
R
A
T
IN
G
E
N
C
ount
ry
:
G
ER
M
AN
Y
d
ecl
ar
e
th
e
fo
ll
o
w
in
g
ap
p
ar
at
u
s
:
P
roduc
t
na
m
e
:
M
ot
he
rboa
rd
M
o
d
e
l n
am
e :
H
97I-
P
L
U
S
co
n
fo
rm
w
it
h
t
h
e
es
sen
ti
al r
eq
u
ir
em
e
n
ts o
f t
h
e f
o
ll
o
w
in
g
d
ir
e
ct
iv
e
s:
20
04
/10
8/E
C
-E
M
C
D
ir
ect
iv
e
E
N
550
22:
2
010+
A
C
:2011
E
N
610
00-
3-
2:
20
06+
A
2:
200
9
E
N
550
13:
2
001+
A
1:
20
03+
A
2
:2006
E
N
550
24:
2
010
E
N
610
00-
3-
3:
20
08
E
N
550
20:
2
007+
A
11:
2
011
19
99
/5/
E
C
-R
&
T
T
E
D
ir
ect
iv
e
E
N
300
328
V
1.
7.
1(
20
06-
10)
E
N
300
440-
1
V
1.
6.
1(
2
010-
0
8)
E
N
300
440-
2
V
1.
4.
1(
2
010-
0
8)
E
N
301
511
V
9.
0.
2(
20
03-
03)
E
N
301
908-
1
V
5.
2.
1(
2
011-
0
5)
E
N
301
908-
2
V
5.
2.
1(
2
011-
0
7)
E
N
301
893
V
1.
6.
1(
20
11-
11)
E
N
302
544-
2
V
1.
1.
1(
2
009-
0
1)
E
N
302
623
V
1.
1.
1(
20
09-
01)
E
N
503
60:
2
001
E
N
624
79:
2
010
E
N
503
85:
2
002
E
N
623
11:
2
008
E
N
301
489-
1
V
1.
9.
2(
2
011-
0
9)
E
N
301
489-
3
V
1.
4.
1(
2
002-
0
8)
E
N
301
489-
4
V
1.
4.
1(
2
009-
0
5)
E
N
301
489-
7
V
1.
3.
1(
2
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1
1)
E
N
301
489-
9
V
1.
4.
1(
2
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1
1)
E
N
301
489-
17
V
2
.2.
1(
2012-
09)
E
N
301
489-
24
V
1
.5.
1(
2010-
09)
E
N
302
326-
2
V
1.
2.
2(
2
007-
0
6)
E
N
302
326-
3
V
1.
3.
1(
2
007-
0
9)
E
N
301
357-
2
V
1.
4.
1(
2
008-
1
1)
E
N
302
291-
1
V
1.
1.
1(
2
005-
0
7)
E
N
302
291-
2
V
1.
1.
1(
2
005-
0
7)
20
06
/95
/E
C
-L
V
D
D
ir
e
ct
iv
e
E
N
609
50-
1
/
A
12
:201
1
E
N
600
65:
2
002
/
A
12:
201
1
20
09
/12
5/E
C
-E
rP
D
ir
e
ct
iv
e
R
egu
lat
ion
(E
C
)
N
o.
127
5/
20
08
R
egu
lat
ion
(E
C
)
N
o.
642
/200
9
R
egu
lat
ion
(E
C
)
N
o.
278
/200
9
R
egu
lat
ion
(E
C
)
N
o.
617
/201
3
20
1
1
/6
5/E
U
-R
o
H
S
D
ir
e
ct
iv
e
V
e
r.
1
4
0
3
3
1
C
E
m
a
rk
in
g
D
ecl
ar
at
io
n
D
at
e:
17
/04/
2
014
Y
e
a
r t
o
b
e
g
in
a
ff
ix
in
g
C
E
m
a
rk
in
g
:
2
0
1
4
P
os
it
ion
:
CE
O
N
am
e
:
Jer
ry
S
h
en
S
ig
nat
ur
e
:
_
___
___
__
_
(E
C
c
o
nf
o
rm
it
y
m
a
rk
ing)
DE
CL
ARAT
IO
N
O
F
CO
NF
O
RM
IT
Y
Pe
r F
CC
P
ar
t 2 S
ec
tion 2. 1077(
a)
R
es
p
on
si
b
le
P
ar
ty N
am
e:
A
su
s
C
om
p
u
ter
In
tern
at
io
n
al
A
d
d
re
ss
:
800 C
or
p
or
at
e W
ay, F
re
m
on
t
, C
A
94
53
9.
P
h
on
e/
F
ax N
o:
(510)
739-
3777/
(510)
608-
4555
he
re
by
de
cl
ar
es
tha
t t
he
pr
oduc
t
P
roduc
t
N
a
m
e
:
M
ot
he
rboa
rd
M
o
d
e
l
N
u
m
b
e
r
:
H
9
7
I-
P
L
U
S
Conf
or
m
s t
o t
he
fol
low
ing
spe
ci
fic
at
ions
:
FC
C P
ar
t 15, S
ubpa
rt B
, U
ni
nt
en
tio
na
l R
ad
ia
to
rs
Suppl
em
ent
ar
y
Inf
or
m
at
io
n:
Thi
s de
vi
ce
com
pl
ies
w
ith
pa
rt
15
of
the
F
CC
R
ul
es
. O
pe
ra
tion
is
subj
ec
t t
o
the
fol
low
ing
tw
o
condi
tions
: (
1)
T
hi
s de
vi
ce
m
ay
not
c
au
se
har
m
fu
l i
nt
er
fer
en
ce,
an
d
(2
) t
hi
s d
ev
ice
m
us
t accep
t an
y
in
ter
fer
en
ce
re
cei
ved
, i
ncl
ud
in
g
in
ter
fer
en
ce
tha
t m
ay
ca
us
e unde
sir
ed ope
ra
tion.
Rep
res
en
tat
iv
e P
er
so
n’
s N
am
e :
S
te
ve
C
h
an
g /
P
re
si
d
en
t
S
ig
na
tu
re
:
D
at
e :
A
p
r.
1
7,
2
01
4
V
e
r.
1
403
31
A-4
Appendices
Summary of Contents for H170I-PLUS D3
Page 1: ...Motherboard H170I PLUS D3 ...
Page 10: ...x ...
Page 15: ...ASUS H170I PLUS D3 1 5 Top of CPU Bottom of CPU Bottom of CPU Top of CPU ...
Page 19: ...ASUS H170I PLUS D3 1 9 2 3 To remove a DIMM B A ...
Page 34: ...1 24 Chapter 1 Product introduction ...
