Mechanical handling
X90 mobile system User's manual V 1.20 - Translation of the original manual
23
4 Mechanical handling
4.1 Solid mechanics
With all the advantages that the X90 mobile system offers, one emphasis has always been solid mechanical design.
The following sections describe the mechanical handling of the X90 mobile system. The following topics are cov-
ered:
•
Structure of an X90 mobile system
•
Device structure with option boards 1 to 4
•
Installation, removal and installing accessories
4.2 Structure of an X90 mobile system
This modularity results in a system that combines maximum flexibility with optimum component density.
•
Robust die-cast aluminum housing
•
Passive cooling
•
Fast startup times
•
Resistant to shock and vibration
•
Modular construction
•
Optimal EMC protection
•
Simple installation
•
Housing temperature: -40°C to 85°C
•
IP69K protection (unused connectors must be protected by suitable protective covers)
Diversity
The MA170 solution gives you all the benefits of remote I/O, yet still allows you to manage all I/O communication in
a central software environment. This saves time and money while creating a very streamlined, intelligent solution.
Device structure
Option board
Mainboard
Figure 7: Device structure
The design of the aluminum upper and lower housing components ensures optimal use in all areas of mobile
automation.
