BCT-ETX-C3-XXX
S
INGLE
B
OARD
C
OMPUTER
I
NSTALLATION
T
HERMAL
P
LATE
The BCT-ETX-C3-XXX Module has been designed to operate in conjunction with a thermal heat-spreading
plate. This 2mm thick aluminium plate is designed to assist in the cooling solution by providing a uniform
thermal interface which thermally couples to the heat generating components of the BCT-ETX-C3-XXX, namely
the North Bridge chip and the CPU itself. This uniform thermal interface allows the user to apply an appropriate
cooling solution such as a fan, heat-sink, heat-pipe or chassis fixing. The heat-spreader plate is not a heat-sink
but may provide adequate cooling for lower power CPUs running non-CPU intensive applications . Clearance
slots in the heat spreader plate permit the user access the SODIMM and ATA Disk Chip Socket for upgrading
the system.