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en | Subsystem Maintenance
RAID Subsystem DVA-16K | Installation Manual
F.01U.027.799 | V2 | 2008.08
Bosch Security System
6
Subsystem Maintenance
6.1
Overview
6.1.1
About Subsystem Maintenance
Constant monitoring and maintenance of your RAID subsystem minimizes subsystem down-
time and preserves the working integrity of the system for a longer period of time. If any of the
subsystem components fail, they must be replaced as soon as possible.
All of the following components can be replaced in case of failure:
1.
Controller modules –
Section 6.2 Replacing Controller Module Components
2.
Memory module –
Section 6.3 DIMM Module Replacement
3.
BBU –
Section 6.4 Replacing a Faulty BBU Module
4.
PSU modules –
Section 6.5 Replacing a Faulty PSU Module
5.
Cooling modules –
Section 6.6 Cooling Module Maintenance
6.
Hard drives –
Section 6.7 Replacing a Failed Hard Drive
6.1.2
General Notes on Component Replacement
•
With the exception of the RAID controller module, all of the components on the RAID sub-
system, including the PSU modules, cooling modules, and drive trays, are hot-swappable
and can be changed while the subsystem is still in operation.
•
Qualified technicians who are familiar with the RAID subsystem should be the only ones
who make component replacements. If you are not familiar with the RAID subsystem or
with RAID subsystem maintenance in general, it is strongly advised that you refer RAID
subsystem maintenance to a suitably qualified maintenance technician.
•
Normalized airflow depends upon the presence of all subsystem components. A subsys-
tem component, even if it has failed, should not be removed from the subsystem until a
replacement is readily at hand and can be quickly installed. Removing subsystem compo-
nents without a replacement can lead to permanent subsystem damage.
•
When replacing any hot-swappable component, caution should be taken to ensure that
the components are handled in an appropriate manner. Rough or improper handling of
components can lead to irreparable damage.
•
When removing a controller module from the subsystem, ensure that the power has been
turned off and that all precautionary measures, without exception, are adhered to. The
controller board and the I/O board on which it is mounted are very sensitive components
and can be easily damaged.
CAUTION!
Do not remove a failed component from the subsystem until you have a replacement on hand.
If you remove a failed component without replacing it, the internal airflow will be disrupted
and the system will overheat, causing damage to the subsystem.
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