5-17
WARNING: DISCONNECT POWER PRIOR TO SERVICING
CAUTION
CAUTION
MANY COMPONENTS IN THE TRANSMITTER ARE
MOUNTED TO HEAT SINKS UTILIZING A FILM OF
HEAT-SINK COMPOUND FOR THERMAL CONDUC
TION.
CAUTION
CAUTION
IF ANY SUCH COMPONENT IS REPLACED, ENSURE A
THIN FILM OF A ZINC-BASED HEAT-SINK
COMPOUND IS USED (BE P/N 700-0028) TO ASSURE
GOOD HEAT DISSIPATION.
5-113.
Once the trouble is isolated, refer to the applicable assembly publication in Part II of this
manual discussing the theory of operation and providing troubleshooting for the respective
assembly to assist in problem resolution. Figures 5-6 through 5-10 provide drawings to
assist component location.
5-114.
COMPONENT REPLACEMENT ON CIRCUIT BOARDS.
All the FM-5T/FM-5TS trans
mitter circuit boards are double-sided boards with plated through-holes with the excep
tion of the transmitter controller main and front panel circuit boards. Due to the double-
sided design, the components on the circuit boards can be replaced without damage if stan
dard soldering techniques are used. The FM-5T/FM-5TS transmitter controller main and
front-panel circuit boards are constructed using surface mount technology. Therefore,
components on the controller main circuit and front-panel circuit boards can not be re-
placed without destruction of the circuit board traces.
5-115.
On all circuit boards, the adhesive securing the copper track to the board melts at almost
the same temperature at which solder melts. A circuit board track can be destroyed by ex
cessive heat or lateral movement during soldering. Use of a small iron with steady pres
sure is required for circuit board repairs.
5-116.
To remove a component from a circuit board, cut the leads from the body of the defective
component while the device is still soldered to the board.
5-117.
Grip each component lead, one at a time, with long nose pliers. Turn the board over and
touch a soldering iron to the lead at the solder connection. When the solder begins to melt,
push the lead through the back side of the board and cut off the bent-over outer end of the
lead. Each lead may now be heated independently and pulled out of each hole. The holes
may be cleared of solder by carefully re-heating with a low wattage iron and removing the
residual solder with a soldering vacuum tool.
5-118.
Install the new component and apply solder from the bottom side of the board. If no dam
age has been done to the plated through-holes, soldering of the top side is not required.
Summary of Contents for FM-5T
Page 1: ...FM 5T FM 5TS 5 KILOWATT FM BROADCAST TRANSMITTERS July 1999 IM No 597 0033 014 ...
Page 14: ...1 3 FIGURE 1 1 FM 5T FM 5TS TRANSMITTER 597 0033 1 COPYRIGHT 1990 BROADCAST ELECTRONICS INC ...
Page 29: ...2 13 COPYRIGHT 1997 BROADCAST ELECTRONICS INC 597 0033 415 FIGURE 2 4 TRANSFORMER TAPS ...
Page 32: ...2 16 597 0033 406 FIGURE 2 6 FM 5T PRIMARY AC WIRING COPYRIGHT 1997 BROADCAST ELECTRONICS INC ...
Page 46: ...3 9 TABLE 3 2 INDICATOR CHECKLIST 597 0098 412 ...
Page 61: ...4 19 FIGURE 4 5 PA CAVITY 597 0032 32 COPYRIGHT 1997 BROADCAST ELECTRONICS INC ...
Page 83: ...5 22 WARNING DISCONNECT POWER PRIOR TO SERVICING BLANK PAGE ...
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