Manual-HotAir-3000-en
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Hold time (HOLD)
The holding time plays a role especially for high temperature solders. When high temperature solder
paste rapidly cools, the tin forms very coarse crystals with undesirable mechanical and physical
properties.
At high temperatures and mechanical effects, the welding spots may easily tear off and lose the
mechanical and electrical connection function, thereby reducing the durability of the product.
By the holding time, the solidification occurs slowly and it form fine crystals.
The temperature is generally set 10-20 ° C lower than the solder melting point.
Cooling time (COOL)
Here the oven is no longer heated and the natural cooling accelerated by a fan. In principle, you can
remove the printed circuit boards when the temperature has fallen below 150 ° C. Please use tools
and personal protective equipment to avoid burns.
Annotation
In general, the soldering temperatures are set as low as possible, so that the components as well as
the printed circuit board are not damaged by thermal stress.
The temperature can also be lowered by extending the reflow time accordingly. This is advantage-
ous for protecting heat sensitive components, connectors and connectors.
Setting of Parameters
In general, the parameters are set during commissioning and each time the requirements change
due to other materials, components or solder pastes.
Start
Turn on the main power switch on the back of the unit and the indicator light in the upper left of the
screen lights up in green. If you press the red
ON-OFF
button, the display on the picture below will
show
USE
,
WELD
and
CONST
.
Bungard Elektronik GmbH & Co. KG, Rilkestraße 1, 51570 Windeck – Germany
Tel.: +49 (0) 2292/9 28 28 - 0, Fax: +49 (0) 2292/9 28 28 - 29, E-mail: support@bungard.de
