WM8940
86
Rev 4.4
PACKAGE DIAGRAM
DM102.C
FL: 24 PIN QFN PLASTIC PACKAGE 4
X
4
X
0.9 mm BODY, 0.50 mm LEAD PITCH
INDEX AREA
(D/2 X E/2)
TOP VIEW
D
E
4
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-8.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
A3
G
T
H
W
b
Exposed lead
Half etch tie bar
Dimensions (mm)
Symbols
MIN
NOM
MAX
NOTE
A
A1
A3
0.80
0.85
0.90
0.05
0.035
0
0.203 REF
b
D
D2
E
E2
e
L
0.30
0.20
4.00 BSC
2.60
2.50
2.40
0.50 BSC
0.35
0.40
0.45
2
2
4.00 BSC
2.60
2.50
2.40
0.10
aaa
bbb
ccc
REF:
0.10
0.10
JEDEC, MO-220, VARIATION VGGD-8.
Tolerances of Form and Position
0.25
H
0.10
0.20
G
T
0.103
W
0.15
DETAIL 1
DETAIL 3
6
1
13
18
24
19
12
e
D2
b 7
1
B
C
bbb
M
A
BOTTOM VIEW
C
aaa
2 X
C
aaa
2 X
1
C
A3
SEATING PLANE
A1
C
0.08
C
ccc
A
5
SIDE VIEW
EXPOSED
GROUND
PADDLE
6
DETAIL 1
0.30mm
45
°
EXPOSED
GROUND
PADDLE
E2
SEE DETAIL 2
L
e
Datum
DETAIL 2
Terminal
Tip
e/2
1
M
M
DETAIL 3