CBM-202PC User’s Manual
36
CITIZEN
6.4 CLEANING METHOD
As flux residue from soldering adversely affects reliability of parts and base PCB, it should be normally
removed by cleaning.
Ultrasonic cleaning, for example, is performed in the following conditions, for which cares should be taken
to an applied frequency, electricity (especially, peak power), time and device resonance to prevent the
device from breakage:
Frequency
..... 28 to 29KHz (Device should not resonate.)
Ultrasonic output
..... 15W/1 (1 time)
Time
..... 30 seconds and less
Others
..... Neither a device nor a PCB board directly touches an oscillation
source.
6.5 STORAGE METHOD
Epoxy resin used in plastic packages, when stored in a humid place, cannot escape
from moisture absorption. Absorbed moisture content, as it gets high, can suddenly
vaporize on soldering implementation, causing peeling of resin/lead frame joint or even
causing a crack on a package. It is, therefore, important to store it in dry environment
(under normal temperature and humidity within 5 to 35
℃
and 45 to 75%RH) in dampproof
package. After opening the package, please keep it in the specified environments to avoid
development of moisture absorption and perform reflow implementation in the shortest
possible time. When restoring it in the dampproof package, place new silica gel.
To remove water content having been absorbed during transport, storage, and handling,
drying (at 125
℃
) for 16 to 24 hours is recommended to be performed.
Store external terminals as they are not yet subject to machining.
This is to prevent soldering failure from taking place on implementation caused by
produced rust, etc..
Summary of Contents for CBM-202PC Series
Page 4: ...CBM 202PC User s Manual 4 CITIZEN 8 2 INTERNATIONAL CHARACTER CODE TABLE 40...
Page 31: ...CBM 202PC User s Manual 31 CITIZEN...
Page 33: ...CBM 202PC User s Manual 33 CITIZEN 5 PACKAGE SPECIFICATIONS...
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Page 40: ...CBM 202PC User s Manual 40 CITIZEN 8 2 INTERNATIONAL CHARACTER CODE TABLE...
