35
English
Specifications
Latest Specification Information
The specifications listed in this sec-
tion are correct at the time of going to
press. Certain items (particularly pro-
cessor types/speeds) may be
changed, delayed or updated due to
the manufacturer's release schedule.
Check with your service center for de-
tails.
Note that this computer model series
may support a range of CPUs and/or
video adapters.
To find out which CPU is installed on
your system go to the
Start
menu and
select
Settings
, and then select
Sys-
tem
and click
About
. This will also
provide information on the amount of
Installed RAM
etc.
To get information on your system’s
video adapter
go to the
Start
menu
and select
Settings
, and then select
System
and click
Display > Ad-
vanced display settings > Display
adapter properties
.
Core Logic
Intel® HM175 Chipset
Memory
Two 260 Pin SO-DIMM Sockets Supporting
DDR4 2400MHz
Memory
(The real memory operating frequency
depends on the FSB of the processor.)
Memory Expandable from
8GB
(
minimum
)
up to
32GB
(
maximum
)
Compatible with 4GB, 8GB or 16GB Mod-
ules
BIOS
AMI BIOS (64Mb SPI Flash-ROM)
LCD Options
15.6" (39.62cm), 16:9, UHD (3840x2160)/
FHD (1920x1080)
Storage
One
changeable 2.5" (6cm)
7.0mm (h)
SATA
(Serial) Hard Disk Drive/Solid State
Drive (SSD)
(
Factory Option
)
One
M.2
SATA/PCIe
Gen3 x4
Solid State Drive (SSD)
Security
Security (Kensington® Type) Lock Slot
BIOS Password
Intel PTT for Systems Without TPM Hard-
ware
(
Factory Option
) TPM 2.0
(
Factory Option
) Fingerprint Reader Mod-
ule
Pointing Device
(
Factory Option
) Built-In Secure Pad (with
Microsoft PTP Multi Gesture & Scrolling
Functionality)
Or
(
Factory Option
) Built-in Touchpad ( (with
Microsoft PTP Multi Gesture & Scrolling
Functionality)
Keyboard
Full Color
Illuminated
Full-size Winkey
Keyboard (with numeric keypad)
Audio
High Definition Audio Compliant Interface
S/PDIF Digital Output
Two Speakers
(
Model A & Model B
Designs I & II
) Sound
BlasterX® Pro-Gaming 360°
(
Model B Design III
) Sound Blaster® Cin-
ema 3
ANSP™ 3D sound technology on head-
phone output
Built-In Array Microphone
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