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©
2022
congatec
GmbH
TSTLm01
21/72
4
Cooling Solutions
congatec GmbH offers the cooling solutions listed in table 8 for the conga-TS570. The dimensions of the cooling solutions are shown in the
sub-sections. All measurements are in millimeters.
Table 8 Cooling Solution Variants
Cooling Solution
Part No.
Description
1
CSA
050750
Active cooling solution with integrated heat pipes and 2.7 mm bore-hole standoffs
050751
Active cooling solution with integrated heat pipes and M2.5 mm threaded standoffs
2
CSP
050752
Passive cooling solution with integrated heat pipes and 2.7 mm bore-hole standoffs
050753
Passive cooling solution with integrated heat pipes and M2.5 mm threaded standoffs
3
HSP
050754
Heatspreader with integrated heat pipes and 2.7 mm bore-hole standoffs
050755
Heatspreader with integrated heat pipes and M2.5 mm threaded standoffs
4
HPA
050756
Standard heatpipe adapter for conga-TS570
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. If your application
that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating temperature
of the module is maintained at all times. This may require additional cooling components for your final application’s thermal solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.
