Xtreme/GbE 24-Port - Managed Carrier Ethernet Switch
Users Guide
Document: CTIM-00455
Revision: 0.04
Page 39 of 46
Connect Tech Inc. 800-426-8979 | 519-836-1291
Date: 2017/08/04
Thermal Details
XDG024 / XDG025 Thermal Parameters
Thermal Parameter
Value
Minimum Ambient Operating Temperature
-40 °C
Maximum Operating Junction Temperature
125 °C
Recommended XDG TDP
15W
SoC TDP (VSC7429)
8W
PHY TDP (VSC8512)
7W
Die junction to package case top (SoC/PHY)
3.27 °C/W
Die junction to PCB (SoC/PHY)
6.03 °C/W
Die junction to Ambient (SoC/PHY)
12.14 °C/W
Die junction to moving air @ 1 m/s (SoC/PHY)
9.42 °C/W
XHG102 – XDG025 Conduction Cooled Heatplate
The XHG102 heatplate shown below is designed for easy installation and conductive thermal extraction from
the XDG025.
