11
soldering & handling
Copyright © 2010-2018 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
®
, the Cree logo and
XLamp
®
are registered trademarks of Cree, Inc. Other trademarks, product and company names are the property of their respective owners and do
not imply specific product and/or vendor endorsement, sponsorship or association. This document is provided for informational purposes only and is
not a warranty or a specification. For product specifications, please see the data sheets available at www.cree.com. For warranty information, please
contact Cree Sales at sales@cree.com.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
C
LD
-A
P
50
R
ev 8
B
Cree
®
XLamp
®
ML Family LEDs
IntroDuCtIon
This application note applies to XLamp
®
ML family LeDs, which
have order codes in the following fomat:
MLxxxx-xx-xxxx-xxxxxx
This application note explains how XLamp ML family LeDs and
assemblies containing these LeDs should be handled during
manufacturing. Please read the entire document to understand
how to properly handle XLamp ML family LeDs.
tabLE oF ContEnts
ML Family LeDs ............................................. 2
Circuit Board Preparation & Layouts ........................................... 3
Case Temperature (T
) Measurement Point ............................... 4
ML family LeDs............................. 4
Low Temperature Operation ........................................................ 7
XLamp
ML Family LED Reflow Soldering Characteristics
Chemicals & Conformal Coatings ............................................... 9
Assembly Storage & Handling ................................................... 10
Tape and Reel ............................................................................. 11
Packaging & Labels ................................................................... 12
