20040402
1-15-1
HG232EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
!
have special characteristics important to safety. Before
replacing any of these components, read carefully the
product safety notice in this service manual. Don't
degrade the safety of the product through improper ser-
vicing.
NOTES:
1.
Parts that are not assigned part numbers (---------)
are not available.
2.
Tolerance of Capacitors and Resistors are noted
with the following symbols.
MCV CBA
MAIN CBA
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Ref. No.
Description
Part No.
MCV CBA
Consists of the following
0VSA15006
MAIN CBA (MCV-A)
JACK CBA (MCV-C)
SENSOR CBA
------------
------------
0VSA14893
Ref. No.
Description
Part No.
MAIN CBA (MCV-A)
-----------
Consists of the following
CAPACITORS
C002
!
METALLIZED FILM CAP. 0.068
µ
F/275V K or
CT2E683HJE06
!
METALLIZED FILM CAP. 0.068
µ
F/250V K
CT2E683DC011
C003
!
SAFTY CAP. 2200pF/250V or
CCN2EMA0E222
!
SAFETY CAP. 2200pF/250V
CA2E222MR049
C004
ELECTROLYTIC CAP. 33
µ
F/400V M(L.Z)
CA2H330NC010
C005
CERAMIC CAP. B K 0.01
µ
F/500V
CCD2JKP0B103
C006
CERAMIC CAP. SL K 56pF/1KV or
CCD3AKPSL560
CERAMIC CAP. SL J 56pF/1KV
CCD3AJPSL560
C007
CERAMIC CAP.(AX) B K 1000pF/50V
CCA1JKT0B102
C008
CERAMIC CAP.(AX) X K 5600pF/16V
CCA1CKT0X562
C010
FILM CAP.(P) 0.022
µ
F/50V J or
CMA1JJS00223
FILM CAP.(P) 0.022
µ
F/50V J
CA1J223MS029
C011
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C012
ELECTROLYTIC CAP. 10
µ
F/50V M H7
CE1JMAVSL100
C014
ELECTROLYTIC CAP. 470
µ
F/35V M or
CE1GMASDL471
ELECTROLYTIC CAP. 470
µ
F/35V M
CE1GMASTL471
C015
ELECTROLYTIC CAP. 47
µ
F/25V M H7
CE1EMAVSL470
C017
ELECTROLYTIC CAP. 470
µ
F/16V M or
CE1CMASDL471
ELECTROLYTIC CAP. 470
µ
F/16V M
CE1CMASTL471
C018
ELECTROLYTIC CAP. 100
µ
F/16V M or
CE1CMASDL101
ELECTROLYTIC CAP. 100
µ
F/16V M
CE1CMASTL101
C020
ELECTROLYTIC CAP. 1000
µ
F/16V M
CE1CMZPTL102
C021
ELECTROLYTIC CAP. 470
µ
F/10V M or
CE1AMASDL471
ELECTROLYTIC CAP. 470
µ
F/10V M
CE1AMASTL471
C022
ELECTROLYTIC CAP. 22
µ
F/16V M H7
CE1CMAVSL220
C025
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C026
ELECTROLYTIC CAP. 47
µ
F/16V M H7
CE1CMAVSL470
C053
ELECTROLYTIC CAP. 220
µ
F/6.3V M H7
CE0KMASSL221
C056
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/25V
CHD1EK30B473
C057
CHIP CERAMIC CAP.(1608) CH J 470pF/50V or
CHD1JJ3CH471
CHIP CERAMIC CAP. CG J 470pF/50V
CHD1JJ3CG471
C151
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C152
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C154
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C155
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C156
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C157
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C158
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C159
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C251
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C252
CHIP CERAMIC CAP. B K 1000pF/50V
CHD1JK30B102
C253
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C254
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C302
CHIP CERAMIC CAP.(1608) B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022
µ
F/25V
CHD1EK30B223
C303
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C304
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C305
CHIP CERAMIC CAP. F Z 0.22
µ
F/16V or
CHD1CZ30F224
CHIP CERAMIC CAP. FZ Z 0.22
µ
F/25V
CHD1EZ3FZ224
C307
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/25V
CHD1EK30B473
C308
CHIP CERAMIC CAP.(1608) B K 0.022
µ
F/50V or
CHD1JK30B223
CHIP CERAMIC CAP.(1608) B K 0.022
µ
F/25V
CHD1EK30B223
C309
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C310
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/50V or
CHD1JK30B473
CHIP CERAMIC CAP.(1608) B K 0.047
µ
F/25V
CHD1EK30B473
C312
CHIP CERAMIC CAP. B K 8200pF/50V
CHD1JK30B822
C313
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C314
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C315
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C316
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C317
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C318
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C319
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C320
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
Ref. No.
Description
Part No.
Summary of Contents for F5000M
Page 22: ...1 8 3 1 8 4 HG232SCM1 Main 1 5 Schematic Diagram...
Page 23: ...Main 2 5 Sensor Schematic Diagrams 1 8 5 1 8 6 HG232SCM2...
Page 24: ...Main 3 5 Schematic Diagram 1 8 7 1 8 8 HG232SCM3...
Page 25: ...Main 4 5 Jack Schematic Diagrams 1 8 9 1 8 10 HG232SCM4...
Page 29: ...1 8 17 1 8 18 Jack CBA Top View Jack CBA Bottom View BHG470F01014C...
Page 35: ...1 13 1 HG232FEX EXPLODED VIEWS Front Panel A1X...
Page 69: ...F5000M HG232ED 2004 04 22...