CYNTEC CO., LTD.
乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
乾坤科技股份有限公司
DOCUMENT : RFB00000
REVISION : A0
PAGE : 5 OF 11
7.
Life Test
Item
Specification
Condition
Resistance to
Soldering Heat
(Dipping)
Electrical characteristics shall be
within specification
Without distinct damage in appearance
Immerse the chip in the solder of 270
r
5
℃
for 10
r
0.5 seconds after preheating for 1
min. at 120 to 150
℃
.
Resistance to
Soldering Heat
(Reflow)
Electrical characteristics shall be
within specification
Without distinct damage in appearance
Rapid change of
Temperature
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1)
Repeat 100 cycle as follows :
(-40
r
3
℃
,30minutes)
o
(Room temperature, 2~3 minutes)
o
(+85
r
2
℃
,30minutes)
o
(Room temperature, 2~3 minutes)
(2)
Measuring resistance 1 hour after test
Moisture with
Load
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1)
Environment condition :
40
r
2
℃
, 90 ~ 95% RH
(2)
Load : 630mA current
(3)
Test period : (1.5 hour ON)
o
(0.5 hour OFF) cycled for
total 1,000 + 48 / - 0 hours
Low Temperature
Load Life
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1)
Store temperature
:
-40
r
2
℃
for total 1000+48/-0hr
(2)
Load : 630mA current
High Temperature
Load Life
Electrical characteristics shall be
within specification
Without distinct damage in appearance
(1)
Store temperature : +85
r
2
℃
for total 1000+48/-0hr
(2)
Load : 630mA current
Temp.
20 ~ 40sec.
240
℃
220
℃
150
r
10
℃
Time
60 ~ 120sec.
