CY62148E MoBL
®
Document #: 38-05442 Rev. *F
Page 4 of 10
Thermal Resistance
[10]
Parameter
Description
Test Conditions
SOIC
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
75
77
°
C/W
Θ
JC
Thermal Resistance
(Junction to Case)
10
13
°
C/W
AC Test Loads and Waveforms
Parameters
5.0V
Unit
R1
1800
Ω
R2
990
Ω
R
TH
639
Ω
V
TH
1.77
V
Data Retention Characteristics
(Over the Operating Range)
Parameter
Description
Conditions
Min
Typ
[3]
Max Unit
V
DR
V
CC
for Data Retention
2
V
I
CCDR
Data Retention Current
V
CC
= V
DR
, CE > V
CC
– 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
Ind’l/Auto-A
1
7
µ
A
t
CDR
[10]
Chip Deselect to Data Retention Time
0
ns
t
R
[11]
Operation Recovery Time
t
RC
ns
Data Retention Waveform
3.0V
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
V
Equivalent to:
THEVENIN
EQUIVALENT
ALL INPUT PULSES
R
TH
R1
V
CC(min)
V
CC(min)
t
CDR
V
DR
> 2.0V
DATA RETENTION MODE
t
R
V
CC
CE
Note
11. Full device operation requires linear V
CC
ramp from V
DR
to V
CC(min)
> 100
µ
s or stable at V
CC(min)
> 100
µ
s.
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