CY8C24223A, CY8C24423A
Document Number: 3-12029 Rev. *E
Page 28 of 31
Packaging Information
This section illustrates the packaging specifications for the CY8C24x23A automotive PSoC device, along with the thermal impedances
for each package and the typical package capacitance on crystal pins.
Important Note
Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled
PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161
.
Figure 17. 20-Pin (210-Mil) SSOP
51-85077 *C
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