150
Chapter 2 Identifying Hardware Components
Table D-1. xStack Storage Array DIMM Specifications
Requirement
Description
PC2700/DDR333 speed
SDRAMs must be JEDEC compliant and DDR333 capable, with a CAS latency of 2.5.
PC3200/DDR400 speed DIMMs can be used if they support a 2.5 CAS latency when
operating at DDR333 speed.
ECC
DIMMs must be organized as x72 bits wide, allowing support for ECC.
X8 RAMs
DIMMs must use 8-bit wide DRAMs that can support data mask (DM) signals. DIMMs that
use 4-bit-wide DRAMs do not provide DM signals and cannot be used.
Registered
DIMMs must be registered as per the JEDEC specification for registered DIMMs.
Buffered
DIMMs must be buffered as per the JEDEC specification for buffered DIMMs.
Organization
Conforming DIMM organizations are shown in Table D-2..
Table D-2. DIMM Organization
DIMM 0 (J36)
System
Memory
Module
DIMM 1 (J37)
System
Memory
Module
Total
System
Memory
DIMM 2 (J38)
Cache
Memory
Module
DIMM 3 (J39)
Cache
Memory
Module
Total
Cache
Memory
Total
Memory
256MB
256MB
512MB
256MB
256MB
512MB
1GB
256MB
256MB
512MB
512MB
512MB
1GB
1.5GB
256MB
256MB
512MB
1GB
1GB
2GB
2.5GB
256MB
256MB
512MB
2GB
2GB
4GB
4.5GB
Summary of Contents for DSN-3400-10 - xStack Storage Area Network Array Hard...
Page 10: ...x Contents...
Page 20: ...20 Chapter 2 Identifying Hardware Components Figure 2 6 Press Lever Inwards Until it Locks...
Page 36: ......
Page 44: ...44 Chapter 4 Starting the xStack Storage Array for the First Time...
Page 103: ...xStack Storage User s Guide 103...
Page 117: ...xStack Storage User s Guide 117 Figure 6 12 Viewing SMART Attributes...
Page 160: ...160 Appendix D Replacing and Upgrading FRUs...
Page 164: ...164 Appendix F Hardware Enclosures...