5.7 Back-channel Cooling Overview
A unique back-channel duct passes cooling air over the heat sinks with minimal air passing through the electronics area.
There is an IP54/Type 12 seal between the back-channel cooling duct and the electronics area of the VLT
®
drive. This back-
channel cooling allows 90% of the heat losses to be exhausted directly outside the enclosure. This design improves
reliability and prolongs component life by dramatically reducing interior temperatures and contamination of the electronic
components. Different back-channel cooling kits are available to redirect the airflow based on individual needs.
5.7.1 Airflow for D1h–D8h Enclosures
130BG068.10
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
Illustration 5.10 Standard Airflow Configuration for Enclosures D1h/D2h (Left), D3h/D4h (Center), and D5h–D8h (Right).
130BG069.10
225 mm (8.9 in)
225 mm (8.9 in)
225 mm (8.9 in)
Illustration 5.11 Optional Airflow Configuration Using Back-channel Cooling Kits for Enclosures D1h–D8h.
(Left) In-bottom/out-back cooling kit for enclosures D1h/D2h.
(Center) In-bottom/out-top cooling kit for enclosures D3h/D4h.
(Right) In-back/out-back cooling kit for enclosures D5–D8h.
Product Features
Design Guide
MG38C202
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