Integration Guide
17
Chapter 5
Quality and Reliability
Test ID Test
Description
1
Shock
Dynamic Shock:
2000 G ± 5% applied via any mounting surface at -30º C and 70º C for a
period of 0.85 ± 0.05 msec.
2500 G ± 5% applied via any mounting surface at 23º C for a period of 0.85 ±
0.05 msec
Vibration:
20 to 80 Hz Ramp up at 0.04 G
2
/Hz at 3 dB/octave
80 to 350 Hz 0.4 G
2
/Hz
350 Hz to 2 kHz Ramp down at 0.04 G
2
/Hz at 3 dB/octave
2
Environmental
Storage Temperature: -40° C to +70° C
Operating Temperature: -15° C to +55° C
Humidity (non-condensing)
≤
95%
4
ESD
The Scan Engine must be shielded from ESD strikes up to ±15KV with the
enclosure.
To date, testing on the Imager Module has been performed at level of 2,5KV
on the connector. The module was tested inside another host product up to
4Kv direct and 8KV air.
5
MTBF
An MTBF calculation has been completed and is shown in Appendix A
Summary of Contents for DSE0420
Page 1: ...DSE0420 Integration Guide OEM Area Imager Decoded Scan Engine ...
Page 4: ...ii DSE0420 NOTES ...
Page 16: ...Optical Characteristics 8 DSE0420 NOTES ...
Page 20: ...Electrical Integration 12 DSE0420 NOTES ...
Page 24: ...Software Features 16 DSE0420 NOTES ...
Page 26: ...Quality and Reliability 18 DSE0420 NOTES ...
Page 28: ...Regulatory Safety 20 DSE0420 NOTES ...
Page 32: ...24 DSE0420 Overall Dimensions ...
Page 33: ...Integration Guide 25 Optical features ...
Page 35: ...Integration Guide 27 Interface Connector Characteristics Requirements ...
Page 36: ...28 DSE0420 NOTES ...
Page 37: ......