D i d o H a r d w a r e M a n u a l
v . 1 . 0 . 5
7.14.1 SPI1.......................................................................................................................67
7.14.2 SPI2.......................................................................................................................68
7.14.3 SPI3.......................................................................................................................68
7.15 I2C buses......................................................................................................................69
7.15.1 I2C2.......................................................................................................................69
7.15.2 I2C3.......................................................................................................................69
7.16 SATA.............................................................................................................................70
7.17 Audio interfaces............................................................................................................70
7.17.1 McASP2.................................................................................................................71
7.18 GPIOs...........................................................................................................................71
7.19 Local Bus......................................................................................................................71
8 Operational characteristics....................................................................................................75
8.1 Maximum ratings.............................................................................................................75
8.2 Recommended ratings....................................................................................................75
8.3 Power consumption........................................................................................................75
8.3.1 Set 1........................................................................................................................76
8.3.2 Use cases................................................................................................................76
8.4 Heat Dissipation..............................................................................................................77
9 Application notes....................................................................................................................78
Index of Tables
Tab. 1: Related documents........................................................................................................8
Tab. 2: Abbreviations and acronyms used in this manual..........................................................9
Tab. 3: CPU, Memories, Busses..............................................................................................14
Tab. 4: Peripherals...................................................................................................................15
Tab. 5: Electrical, Mechanical and Environmental Specifications............................................15
Tab. 6: DM814x/AM387x comparison......................................................................................18
Tab. 7: DDR2 specifications.....................................................................................................18
Tab. 8: NOR flash specifications..............................................................................................18
Tab. 9: NAND flash specifications............................................................................................19
Tab. 10: ZFF form factor – example of pinout differences.......................................................20
Illustration Index
Fig. 1: DIDO CPU module.........................................................................................................11
Fig. 2: DIDO (top-right), NAON (top-left) and MAYA (bottom)...................................................11
Fig. 3: DIDO SOM (top view)....................................................................................................12
Fig. 4: Board layout - top view..................................................................................................21
Fig. 5: Board layout - size view.................................................................................................22
Fig. 6: Connectors layout..........................................................................................................23
Fig. 7: Simplified schematics of EN_BCK2_LS internal pin configuration................................46
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