17
4.2
Wrapping a heat shrinkable sleeve around the head piece/connection element
Applying heat shrinkable sleeves
After mounting the head piece/connection element on the
HVI long Conductor
, a heat shrinkable
sleeve must be wrapped around the relevant mounting areas to protect them from mechanical, en-
vironmental or chemical infl uences. One/two heat shrinkable sleeves are available (supplied with the
connection set).
The following must be observed when wrapping a heat shrinkable sleeve around the head
piece/connection element:
Â
The indicated shrinking area from the head piece/connection element to the
HVI Conductor
must
be observed (Fig. 3).
Â
The heat shrinkable sleeve is applied from the front shrinking area of the relevant head piece/
connection element to the
HVI Conductor
. The heat shrinkable sleeves must fl ush with the shrin-
king area. If, required they must be repositioned during the shrinking on process.
Â
The specifi ed shrinking temperature of max. 150 °C must be observed!
Â
The shrinking temperatures in the shrinking area of the
HVI Conductor
must not be too high. In
case of excessive shrinking temperatures, the semiconductive sheath of the
HVI Conductor
can be
damaged or destroyed and the function of the
HVI Conductor
may not be ensured any more.
Â
The heat shrinkable sleeve must not trap air or form bubbles!
Figure 3
Wrapping around a heat shrinkable sleeve around the head piece/connection element
Shrinking area of the
connection element
Shrinking area of the
connection element
Shrinking area of the head
piece
Correct shrinking
Incorrect
shrinking
