System Specifications
System specifications include minimum and maximum power consumption and heat dissipation values, temperature and humidity
requirements, sound power and pressure levels, and other specifications.
Topics:
•
•
Power consumption and heat dissipation
•
•
Air volume, air quality, and temperature
•
•
Sound power and sound pressure
•
•
Radio frequency interference
Electro-magnetic fields, which include radio frequencies can interfere with the operation of electronic equipment. Dell EMC products have
been certified to withstand radio frequency interference (RFI) in accordance with standard EN61000-4-3. In Data Centers that employ
intentional radiators, such as cell phone repeaters, the maximum ambient RF field strength should not exceed 3 Volts /meter.
The field measurements should be taken at multiple points in close proximity to Dell EMC equipment. It is recommended to consult with an
expert prior to installing any emitting device in the Data Center. In addition, it may be necessary to contract an environmental consultant
to perform the evaluation of RFI field strength and address the mitigation efforts if high levels of RFI are suspected.
The ambient RFI field strength is inversely proportional to the distance and power level of the emitting device.
Recommended minimum distance from RF emitting device
The following table provides the recommended minimum distances between Dell EMC arrays and RFI emitting equipment. Use these
guidelines to verify that cell phone repeaters or other intentional radiator devices are at a safe distance from the equipment.
Table 5. Minimum distance from RF emitting devices
Recommended minimum distance
1 Watt
9.84 ft (3 m)
2 Watt
13.12 ft (4 m)
5 Watt
19.69 ft (6 m)
7 Watt
22.97 ft (7 m)
10 Watt
26.25 ft (8 m)
12 Watt
29.53 ft (9 m)
15 Watt
32.81 ft (10 m)
a.
Effective Radiated Power (ERP)
Power consumption and heat dissipation
Use the
to refine the power and heat figures to more closely match your array. Contact your sales
representative or use the Power Calculator for specific supported configurations. The following table provides calculations of maximum
power and heat dissipation.
3
System Specifications
13
