Document purpose
This document provides information on the location and removal of reportable
materials as required by the European Union (EU) Waste Electrical and Electronic
Equipment (WEEE) Directive 2002/96/EC 2012/19/EC.
Related documentation
Separate WEEE disassembly instructions are provided per product platform.
Additional information can be found in the support documentation for each specific
product platform.
Acronyms
The following are the acronyms that may be used in this document.
Table 1 Acronym List
Acrony
m
Meaning
ABS
Acrylonitrile butadiene styrene
Ag
Silver
Au
Gold
BBU
Battery Backup Unit
Cd
Cadmium
CFC
Chlorofluorocarbons
CPU
Central Processing Unit
Cr Vl
Hexavalent Chromium
Cu
Copper
DAE
Disk Array enclosure
DIMMs
Dual in-line Memory Modules
DPE
Disk Processor Enclosure
DRL
Device Regulatory Label
EMI
Electromagnetic Interference
ESD
Electrostatic discharge
EU
European Union
GWP
Global Warming Potential
HC
Hydrocarbons
HCFC
Hydrochlorofluorocarbons
Hg
Mercury
WEEE Disassembly Instructions
2
EU2SPE
WEEE Disassembly Instructions
