Manual DHMI 10.1
R01
USM_DHMI 10.1
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Product description
The DHMI 10.1 is a compact touch panel computer that has already proven itself in harsh industrial environments.
Thanks to resistive 4-wire touch, operation is possible at any time even under difficult conditions, for example
with gloves or in damp conditions. We use high-performance and at the same time energy-saving DHCOM mod-
ules from our DHSOM product family as the computer core, giving you the greatest possible flexibility in the choice
of computer module. In the following we present the advantages of our touch panel computers compared to com-
petitive products:
DH Modular system
Thanks to our family concept based on a modular system, you can configure your HMI entirely according to
your wishes and requirements. To do this, use existing components that have been proven in practice and
combine them as you wish to obtain the optimum solution for your application. Our modular principle gives
you maximum flexibility and allows you to develop the right solution for you quickly and cost-effectively. In
addition to the frame design, you can also determine the choice of computer module and interfaces yourself
during customized development.
Everything from one source
DH electronics is characterized by combined know-how in the fields of software and hardware. Our experi-
ence in both areas enables us to develop completely thought-out, high-performance complete devices,
which we realize completely ourselves from the idea to the implementation. As our customer, you will al-
ways have a competent contact person at hand for all matters, who will take care of your request as quickly
as possible.
Fast and cost-effective development
Thanks to the use of our proven computer modules from the DHSOM product range, we can offer you a quickly
available solution at favorable conditions. Computing power, interfaces, operating system and much more
can thus be individually adapted to your needs.
Cost-saving solution thanks to innovative 5-cent cooling system
Our innovative cooling solution eliminates the need for conventional heat sinks, saving space and cost. In-
stead, heat is dissipated from the processor through thermal vias into the inner copper layers of the PCB over
a 5-cent copper area using a gap pad. There, the heat is distributed evenly over the carrier board and is
dissipated by it to the environment primarily by convection and thermal radiation. The even heat distribution
protects the remaining components from overheating.