Manufacturing information
Reworking
XBee 868LP RF Modules User Guide
213
serves as a guideline in such cases to increase the chances of success during rework, though the
warranty is still voided.
The device may be removed from the OEM PCB by the use of a hot air rework station, or hot plate. Be
careful not to overheat the device. During rework, the device temperature may rise above its internal
solder melting point and care should be taken not to dislodge internal components from their
intended positions.