Contents
2.3
SINGLE INLINE MEMORY MODULES
2–24
2.3.1
Connector
2–24
2.3.2
Physical Mounting
2–25
2.4
ISA OPTION MODULES
2–25
2.5
PCI OPTION MODULES
2–26
CHAPTER 3
ENVIRONMENTAL DATA
3–1
3.1
COOLING REQUIREMENTS
3–1
3.1.1
Air Flow
3–1
3.1.2
DECchip 21066 Heatsink Selection
3–1
3.1.2.1
DECchip 21066 (166 MHz) Cooling Requirements • 3–2
3.1.2.2
DECchip 21066A (233 MHz) Cooling Requirements • 3–4
3.1.2.3
DECchip 21068 (66 MHz) Cooling Requirements • 3–5
3.1.2.4
DECchip 21068A (100 MHz) Cooling Requirements • 3–6
3.1.2.5
Custom Heatsink Design • 3–8
3.2
DC POWER INPUTS
3–9
3.2.1
System Power Requirements
3–9
3.2.2
Power Sequencing
3–10
3.2.3
POWER GOOD Signal
3–10
3.3
ELECTROSTATIC DISCHARGE CONSIDERATIONS
3–11
3.4
TELECOMMUNICATION REGULATORY STANDARDS
3–11
3.5
ELECTROMAGNETIC COMPATIBILITY CONSIDERATIONS
3–11
3.6
RELIABILITY DATA
3–12
APPENDIX A
SUPPLIERS AND PART NUMBERS
A–1
A.1
MAIN LOGIC BOARD CONFIGURATIONS
A–1
iv
Summary of Contents for AXPpci 33
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Page 23: ...Physical Description Figure 2 3 MLB Component Outline Drawing MR 6401 AI 2 5...
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