DPtech DPX19000 Series Deep Service Switching Gateway
Installation Manual
Chapter 3 Installation Preparation
2
materials, greatly lower the device reliability, and hence significantly shorten its service life.
0 describes the details of device temperature/humidity.
Table3-1Temperature/ humidity requirement for equipment room
Temperature
Relative Humidity
5
℃~
40
℃
20%
~
80%
(
non- condensation
)
3.2.2 Cleanliness
Dust is a hazard to the operating safety of your device. The dust accumulated on the chassis can cause
electrostatic adsorption, one of the sources that cause the poor contact of connectors or metal contact
points. This not only shortens the service life of your device but also causes communications failures.
When the indoor relative humidity is low, electrostatic adsorption is more likely to happen.
The equipment room must be free of explosion hazards and the electric and magnetic conductible dust as
well. The contents of the dust must be limited to the values shown in 0.
Table3-2 Dust limit in the equipment room
Substance
Unit
Content
Dust
Particles/m³
≤
3
×
10
4
(
No visible dust on the
table top for three days
)
Note: Diameter of a dust particle
≥
5
μ
m
Besides the dust, there are rigorous limits on the harmful gases that can accelerate the erosion and aging
of metals, such as salts, acids, and sulfides. Equipment room should prevent from harmful gases such as
SO2
、
H2S
、
NH3
、
Cl2, as shown in 0.
TAble3-3 Limit of harmful gases in the equipment room
Gas
Maximum (mg/m3)
SO
2
0.2
H
2
S
0.006
NH
3
0.05
Cl
2
0.01
3.2.3 ESD requirements
Although the switch is designed to be electrostatic discharge (ESD) preventive, the card circuits and even
Summary of Contents for DPX19000 Series
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