DPtech LSW5003 Series Industrial Ethernet Switch Installation Manual
Chapter 2Installation
15
Table2-1
Temperature/humidity requirement
Temperature
Relative humidity
-40
℃～
70
℃
0%
～
95% (non-condensation)
2.2.2 Cleanliness
Dust is a hazard to the operating safety of your device. The dust accumulated on the chassis can cause
electrostatic adsorption, one of the sources that cause the poor contact of connectors or metal contact
points. This not only shortens the service life of your device but also causes communications failures.
When the indoor relative humidity is low, electrostatic adsorption is more likely to happen.
The equipment room must be free of explosion hazards and the electric and magnetic conductible dust
as well. The contents of the dust must be limited to the values shown in Table 2-2.
Table2-2
Dust limit in the equipment room
Substance
Unit
Content
Dust
Particles/m
³
≤
3
×
10
4
(No visible dust on the
table top for three days)
Note: Diameter of a dust particle
≥
5
μ
m
Besides the dust, there are rigorous limits on the harmful gases that can accelerate the erosion and
aging of metals, such as salts, acids, and sulfides. Equipment room should prevent from harmful gases
such as SO
2
、
H
2
S
、
NH
3
、
Cl
2,
as shown in Table2-3
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Table2-3
Limit of harmful gases in the equipment room
Gas
Maximum (mg/m3)
SO
2
0.2
H
2
S
0.006
NH
3
0.05
Cl
2
0.01
2.2.3 ESD requirement
Although the switch is designed to be electrostatic discharge (ESD) preventive, the card circuits and
even the device can be badly damaged when excessive static electricity is present. To get much better
ESD effect, you should:
Connect your device to the earth ground properly.
