中龙集团
Dragon Group China Limited
BIRD
®
H. Related information
1. How to deal with the Voids produced by the lead BGA in lead-free
soldering?
As the development of the lead-free technology, more and more SMT processing
enterprises come across the problem of Voids in production.
Many companies try to avoid using lead BGA in lead-free soldering technology.
Because the melting point of lead soldering balls is lower than lead-free tin paste. The tin
balls melt first and surround the tin paste, so that the flux in the paste can't volatilize, and
form bubbles inside. If there is via on the soldering pad, there may be more bubbles.
Steps of desoldering and replacing BGA/CSP with lead-free desoldering materials:
Set the temperature curve;
Desoldering the broken parts;
Clean and preparation for the repair work;
Remount the reworked parts with flux paste.
Detection of reflow soldering.
a
. Requirement of devices in reworking
Repairing method of BGA/CSP is convection, not radiation, so soldering iron is not
the ideal choice. In normal reworking of BGA, it is difficult to use IR, because the
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