中龙集团
Dragon Group China Limited
BIRD
®
A.
BGA Rework Station
1. Knowledge about BGA
BGA is short for Ball Grid Array. It is a kind of package method which use organic
carrier in IC. It has the following features:
①
Small package area.
②
Greater functions and more pins.
③
Self
-
centerize while PCB puddle welding, easy to put on tin.
④
More reliable.
⑤
Good conductivity and low overall cost.
Memory which applies BGA can enlarge the memory capacity by 2 to 3 times while the
volume of memory remains the same. Compared with TSOP, BGA is much smaller and
better at radiating and conducting electricity.
2. Types and Features of BGA
a. Types
According to the encapsulation material, BGA can be classified into the following types:
(1)PBGA
(
Plastic BGA
)
(2)CBGA
(
Ceramic BGA
)
(3)CCBGA
(
Ceramic Column BGA
)
(4)TBGA
(
Tape BGA
)
(5)CSP (Chip Scale Package or MBGA)
b. Features
Compared with QFP, BGA has the following features:
(1) I/O terminal space is big (eg. 1.0mm, 1.27mm, 1.5mm), and it can accommodate more
I/O.
(2) More reliable package, low rate of welding defects and welding spot durable.
(3) Paraposition of QFP is usually observed with naked eyes. When the pin space is
smaller than 0.4mm, it is hard to paraposition and weld. While the pin space of BGA is
bigger, by applying the paraposition-amplification device, it is easy to paraposition and
weld.
(4) The welding coplanarity of BGA is better than QFP, because solder can make up the
flat error between BGA and PCB after melting.
Summary of Contents for Bird AC-5K
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