中龙集团
Dragon Group China Limited
BIRD
®
I. Tips for operation
1
. After turn on the head power switch, check whether the upper hot-air nozzle gives out
cool breeze. If not, never start the machine, or the upper heater may be burnt.
2.
Set different temperature curves for different BGA. The temperature should not be
higher than 250. In lead
℃
-free soldering, it can be set according to the soldering
temperature curve of BGA soldering balls.
3
. When desoldering BGA, turn the cooling fan to auto. After the temperature curve goes
over, the buzzer alarms automatically. Then remove BGA form PCB quickly with a
vacuum suction pen and take PCB away from the positioning bracket.
4
. When desoldering BGA, turn the cooling fan to auto. After the temperature curve goes
over, the buzzer alarms automatically. The cooling fan begins to cool BGA and the lower
heating area. The hot-air nozzle gives out cold breeze at the same time. The upper main
heater arises to 8-10mm from the surface of BGA and pauses for 30-40s. Or after the
working light is off, move the main heater away and take PCB away from the positioning
bracket.
5
. Before soldering BGA, check the PCB pad and BGA balls one by one. After soldering,
check the appearance one by one again. If there is some problem, stop assembling and
check the temperature. Continue after adjust it well. Or the BGA and PCB may be
destroyed.
6
. Clean the surface of the machine regularly, especially the infrared heating board. Don't
leave dirt plot on the board to prevent it from radiating, or the soldering may be a failure
and the life of infrared heater will be significantly shortened. (If the infrared heater is
destroyed due to this reason, our company will not change it for free.)
7
. When we use the optical place system, we must turn the self-lock (heating head and
nozzle) switch to auto, or the heating head and nozzle can not rotate freely.
Those who are not trained by our company mustn't modify the parameters or disassembly
the control box.
Conclusion
In the productive area of electronic products, especially the computer and communicative
electronics areas, the components to miniaturization, multifuctionize and greenize.
Different kinds of packaging technology emerge, while BGA/CSP is the mainstream.
To meet the fast-increasing demand of BGA circuit assembly, the manufacture companies
need to choose safer, faster and more convenient assembly and rework technology.
Summary of Contents for Bird AC-5K
Page 18: ...Dragon Group China Limited BIRD www dragongroupchina com www chinaemall biz...
Page 19: ...Dragon Group China Limited BIRD www dragongroupchina com www chinaemall biz...
Page 26: ...Dragon Group China Limited BIRD www dragongroupchina com www chinaemall biz...
Page 31: ...Dragon Group China Limited BIRD www dragongroupchina com www chinaemall biz...