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Chengdu Ebyte Electronic Technology Co., Ltd.

E01-ML01DP4 User Manual

Copyright ©2012–2018

Chengdu Ebyte Electronic Technology Co.,Ltd

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4. Basic operation

4.1 Hardware design

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It is recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and
the module needs to be reliably grounded

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Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse
connection may cause permanent damage to the module

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Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the
maximum value the module will be permanently damaged;

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Please check the stability of the power supply, the voltage cannot be fluctuated frequently

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When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the
margin, so the whole machine is beneficial for long-term stable operation;

10 The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other

parts with large electromagnetic interference;

11 High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the

module. If it is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the
copper is spread on the Top Layer of the module contact part(well grounded), it must be close to the digital part of
the module and routed in the Bottom Layer

12 Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer

or other layers, which will affect the module's spurs and receiving sensitivity to varying degrees

13 It is assumed that there are devices with large electromagnetic interference around the module that will greatly

affect the performance. It is recommended to keep them away from the module according to the strength of the
interference. If necessary, appropriate isolation and shielding can be done

14 Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog,

power traces) around the module that will greatly affect the performance of the module. It is recommended to stay
away from the module according to the strength of the interference. If necessary, appropriate isolation and shielding
can be done.

15 If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is

still a risk of damage)

16 Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0

17 The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure

that the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good
antenna extension cable to extend the antenna to the outside

18 The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly

weakened.

19 Conductors or other sources of interference should be avoided around the onboard PCB antenna.

Summary of Contents for E01-ML01DP4

Page 1: ... E01 ML01DP4 User Manual nRF24L01P 2 4GHz 100mW DIP wireless module ...

Page 2: ...nd parameter 3 2 1 Limit parameter 3 2 2 Operating parameter 3 3 Size and pin definition 4 4 Basic operation 5 4 1 Hardware design 5 4 2 Software editing 6 5 Basic application 6 5 1 Basic circuit diagram 6 6 FAQ 6 6 1 Communication range is too short 6 6 2 Module is easy to damage 7 6 3 BER Bit Error Rate is high 7 7 Production guidance 7 8 E01 Series 7 9 Packing 8 9 1 Anti statistic pallet 8 Revi...

Page 3: ... design The user needs to use the MCU driver or use a dedicated SPI debugging tool to develop E01 ML01DP4 1 2 Features Communication distance tested is up to 1 8KM Maximum transmission power of 100mW software multi level adjustable Support air date rate of 2Mbps 1Mbps 250kbps 125 communication channels to meet the needs of multi point communication grouping frequency hopping etc Connect to the MCU...

Page 4: ... it may be at risk of burning down Operating temperature 40 85 Industrial design Operating frequency MHz 2 4 2 525 Support ISM band Power consumption TX current mA 110 Instant power consumption RX current mA 20 Sleep current μA 1 0 Software is shut down Max Tx power dBm 19 7 20 20 2 Receiving sensitivity dBm 95 5 96 97 5 Air data rate is 250kbps Air data rate bps 250k 2M Controlled via user s prog...

Page 5: ...gy Co Ltd 4 3 Size and pin definition Pin No Pin item Pin direction Pin application 1 GND Ground 2 VCC Power supply must be 20 3 6V 3 CE Input Chip Enable 4 CSN Input SPI Chip select 5 SCK Input SPI clock 6 MOSI Input SPI master output slave input 7 MISO Output SPI master input slave output 8 IRQ Output Interrupt request ...

Page 6: ...routed in the Bottom Layer 12 Assuming the module is soldered or placed over the Top Layer it is wrong to randomly route over the Bottom Layer or other layers which will affect the module s spurs and receiving sensitivity to varying degrees 13 It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the performance It is recommended to...

Page 7: ... enable pin when CE equal to 1 LNA is turned on when CE to 0 LNA is turned off This operation is perfectly matched with the transceiver mode of nRF24L01 that is to say users do not have to care about the LNA operation If the automatic response is needed the CE pin must keep high level when transmitting instead of keeping high level time just more than 10us like the datasheet mentioned The operatio...

Page 8: ...he voltage cannot fluctuate too much Please make sure antistatic measure are taken when installing and using high frequency devices have electrostatic susceptibility Please ensure the humidity is within limited range some parts are sensitive to humidity Please avoid using modules under too high or too low temperature 6 3 BER Bit Error Rate is high There are co channel signal interference nearby pl...

Page 9: ...CB E01 ML01DP5 nRF24L01P 2 4G 20 2 5 DIP SMA K E01 ML01SP2 nRF24L01P 2 4G 20 1 8 SMD PCB IPEX E01 ML01SP4 nRF24L01P 2 4G 20 2 SMD IPEX E01 2G4M27D nRF24L01P 2 4G 27 5 DIP SMA K 9 Packing 9 1 Anti statistic pallet Revision history Version Date Description Issued by 1 00 2017 11 15 Original version huaa 1 10 2018 5 22 Content updated huaa 1 20 2018 9 13 Model No split huaa ...

Page 10: ...Circuit diagram modification Linson About us Technical support support cdebyte com Documents and RF Setting download link www ebyte com Thank you for using Ebyte products Please contact us with any questions or suggestions info cdebyte com Fax 028 64146160 ext 821 Web www ebyte com Address Innovation Center D347 4 XI XIN Road Chengdu Sichuan China ...

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