Chengdu Ebyte Electronic Technology Co., Ltd.
Copyright ©2012–2018, Chengdu Ebyte Electronic Technology Co.,Ltd.
9
Please make sure anti-static measures are taken when installing and using, high frequency devices have electrostatic
susceptibility.
Please ensure the humidity is within limited range for some parts are sensitive to humidity.
Please avoid using modules under too high or too low temperature.
5.3 High bit error rate
There are co-channel signal interference nearby, keep away from interference sources or modify frequency, channel
to avoid interference.
The clock waveform on the SPI is not standard. Check whether there is interference on the SPI line. The SPI bus
line should not be too long.
Unsatisfactory power supply may also cause garbled characters, and ensure the reliability of the power supply.
If the extension cable or feeder is of poor quality or too long, the bit error rate will be high.
6. Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating
temperature
100
℃
150
℃
Preheat temperature max (Tsmax)
Maximum
preheating
temperature
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temperature
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temperature
220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to Tsmax
）
Average descent rate
6
℃
/second max
6
℃
/second max
Time 25℃ to peak temperature
Time of 25 ° C to peak
temperature
6 minutes max
8 minutes max
