Chengdu Ebyte Electronic Technology Co., Ltd.
Copyright ©2012–2018, Chengdu Ebyte Electronic Technology Co.,Ltd.
13
10.Welding operation guidance
10.1 Reflow temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
(
Tsmin
)
Mini.preheating
temperature
100℃
150℃
Preheat temperature max (Tsmax)
Max. preheating
temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating temperature
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average Rising Rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temperature
183℃
217℃
Time
(
tL
)
Maintained Above
(
TL
)
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
(
Tp
)
Peak Temperature
220-235℃
230-250℃
Aveage ramp-down rate
(
Tp to Tsmax
)
Average Decline Rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time from 25℃ to peak
temperature
6 minutes max
8 minutes max
10.2 Reflow profile