nRF52832/nRF52810 Wireless Module
User Manual of E73 Series Modules
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd.
7
/
9
3. Development and Application
No.
Item
Notes
1
Burn Firmware
1. The module is embedded with ARM MCU. For program downloading, please use the J-LINK
downloader, any other serial port or JTAG、ISP、ICP are unavailable to download.
2. There are two ways to download the program. The protocol stack of NORDIC is not
programmed yet, so users need to use the official nRFgo studio of NORDIC to program the
protocol stack first, then program the hex of application code. Or, to program the protocol stack
of NORDIC first and download via the IAR or KEIL.
Website of tool download:
http://www.nordicsemi.com/eng/Products/Bluetooth-low-energy/nRF52832/(language)/eng-G
B
2
Testing Board
Testing board is not available.
4. Production Guidance
4.1 Reflow Soldering Temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
100℃
150℃
Preheat temperature max (Tsmax)
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3℃/second max
3℃/second max
Liquidous Temperature (TL)
183℃
217℃
Time(tL)Maintained Above(TL)
60-90 sec
30-90 sec
Peak temperature(Tp)
220-235℃
230-250℃
Aveage ramp-down rate(Tp to Tsmax)
6℃/second max
6℃/second max
Time 25℃ to peak temperature
6 minutes max
8 minutes max