Chengdu Ebyte Electronic Technology Co., Ltd.
E73-2G4M04S1B User
manual
Copyright ©2012–2018，Chengdu Ebyte Electronic Technology Co.,Ltd.
10
Solder Paste
Solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min
（
Tsmin
）
Minimum preheating temperature
100
℃
150
℃
Preheat temperature max (Tsmax)
Maximum preheating temperature
150
℃
200
℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3
℃
/second max
3
℃
/second max
Liquidous Temperature (TL)
Liquid phase temperature
183
℃
217
℃
Time
（
tL
）
Maintained Above
（
TL
）
Time above liquidus
60-90 sec
30-90 sec
Peak temperature
（
Tp
）
Peak temperature
220-235
℃
230-250
℃
Aveage ramp-down rate
（
Tp to
Tsmax
）
Average descent rate
6
℃
/second max
6
℃
/second max
Time 25
℃
to peak temperature
Time of 25 ° C to peak temperature
6 minutes max
8 minutes max
6.2 Reflow Soldering Curve
7.Related Model
Model
Chip
Frequency
Hz
Transmit
power
dBm
Test
distance
km
Air Data rate Packaging
Size
mm
Anten
na
Type
nRF52840
2.4G
8
0.1
BLE 4.2/5.0
SMD
13.0 *
18.0
PCB/IP
X
E73-2G4M04S1A
nRF52810
2.4G
4
0.1
BLE 4.2
PCB/IPEX
17.5 *
PCB/IP
