Chengdu Ebyte Electronic Technology Co.,Ltd.
E76-433M20S User Manual
Copyright ©2012–2018, Chengdu Ebyte Electronic Technology Co.,Ltd.
7
6.
Welding operation guidance
6.1 Reflow Soldering Temperature
Profile Feature
Curve feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
solder paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin)
Minimum preheating temperature
100℃
150℃
Preheat temperature max (Tsmax)
Maximum preheating temperature
150℃
200℃
Preheat Time (Tsmin to Tsmax)(ts)
Preheating time
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
Average rising rate
3℃/second max
3℃/second max
Liquidous Temperature (TL)
Liquid phase temperature
183℃
217℃
Time(tL)Maintained Above(TL)
Time above liquidus
60-90 sec
30-90 sec
Peak temperature(Tp)
Peak temperature
220-235℃
230-250℃
Aveage ramp-down rate(Tp to Tsmax)
Average descent rate
6℃/second max
6℃/second max
Time 25℃ to peak temperature
Time of 25 ° C to peak temperature
6 minutes max
8 minutes max
6.2 Reflow Soldering Curve
