eSE Series
8
•
Pad Diagrams (V1.1) 01.17.2005
(These diagrams are subject to change without further notice)
8 eSE030 Pad Diagram
VO2
VSSC
VO1
(0,0)
eSE030
4
5
6
7
8
9
10
11
12
13
14
P2.
2
P2.
3
P3.
0
P3.
1
P3.
2
P3.
3
VDD
VCC
18
OSCI
15
16
17
VSSD
P2.
0
P2.
1
Pin No.
Symbol
X
Y
Pin No.
Symbol
X
Y
1 NC
13 P2.3
66.2
-718.4
2 NC
14 P2.2
192.6
-718.4
3 NC
15 P2.1
315.6
-718.4
4 VCC
-588.0
-163.9 16 P2.0
442.0
-718.4
5 VO2
-588.0
-283.9 17
VSSD
579.6
-718.4
6 VSSC
-588.0
-403.9 18 OSCI
573.4
-541.5
7 VO1
-568.0
-523.9 19 NC
8 VDD
-570.2
-718.4 20 NC
9 P3.3
-432.6
-718.4 21 NC
10 P3.2
-306.2
-718.4 22 NC
11 P3.1
-183.2
-718.4 23 NC
12 P3.0
-56.8
-718.4 24 NC
Chip size
:
1500 * 1800
µ
m
For PCB layout, IC substrate must be connected to VSS (negative power).
NOTE:
1. VO should be floating or connected to VSS (negative power) when not in use.
2. VSSD & VSSC should be connected together with negative power.
3. VCC & VDD should be of the same level with the positive power voltage.
