Link Layer Tests
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The value of tLinkTurnAround is 500ns and is defined in the USB 3.0 Link
Layer Test Specification, Section 4. Please refer to that document for
details.
The test passes if the PUT goes to recovery within tLinkTurnAround after
reception of the second LGOOD_0.
Specification Reference
Section 7.3.4#4
7.15
Wrong LCRD_X Sequence Test
Test Summary
This test verifies that the PUT will go to recovery when it receives an incorrect LCRD_X
sequence.
Test Steps and Expected Results
1.
Examiner performs steps 1 to 4 of TD7.1 (Link Bring-Up Test) with the exception that
Examiner will send an LCRD_A for the first LMP packet as expected, but will send again an
LCRD_A for the second LMP packet.
The test passes if the PUT goes to recovery within tLinkTurnAround after
reception of the second LCRD_A.
The value of tLinkTurnAround is 500ns and is defined in the USB 3.0 Link
Layer Test Specification, Section 4. Please refer to that document for
details.
Specification Reference
Section 7.3.4#5
7.16
Link Command Missing Test (Upstream Port Only)
Test Summary
This test verifies that the PUT will go to Recovery if no Link Commands are received for more
than tU0RecoveryTimeout.